Osterman, Michael
Director, CALCE Electronic Products and System Consortium
Center for Advanced Lifecycle Engineering
BACKGROUND
Dr. Michael Osterman (Ph.D., University of Maryland, 1991) is a Research Scientist and the director of the CALCE Electronic Products and System Consortium at the University of Maryland. He heads the development of simulation-assisted reliability assessment software for CALCE and simulation approaches for estimating the time to failure of electronic hardware under test and field conditions. Dr. Osterman served as a subject matter expert on phase I and II of the Lead-free Manhattan Project sponsored by the Office of Naval Research in conjunction with the Joint Defense Manufacturing Technical Panel (JDMTP). He has consulted with automotive, medical, defense, and industrial electronic companies on the transition to lead-free materials. He organized and chaired the International Symposium on Tin Whiskers from 2007 to 2013. He has written eight book chapters and over 120 articles. He is a senior member of IEEE and a member of ASME, IMAPS, and SMTA
Simulation assisted reliability assessment of electronic hardware
Solder interconnection fatigue testing and modeling
Corrosion testing for electronic equipment
2024
Thermal Cycle Fatigue Life of Low-Temperature Solders, Michael Osterman and Aaron Mendelsohn, SMTA International, 2024
Solder Performance and Reliability Assurance (SPRA) Project - Solder Performance Specification and User Handbook for Defense Systems, Michael Osterman, SMTA International, 2024
The Effect of Board Design on the Drop Shock Performance of Lead-Free Solder Alloys, Saddam Daradkeh, Elizabeth Gainey, Mohamed El Amine Belhadi, Abdallah Alakayleh, Menghong Wang, John Evans, Sa’d Hamasha, Michael Osterman, John Blendell, SMTA International, 2024
Thermal Cycling and Drop Shock Test Program for Defense-Purpose High-Performance Lead-Free Solder Alloys, Menghong Wang, Sa’d Hamasha, Mohamed El Amine Belhadi, Palash Pranav Vyas, John Blendell, Michael Osterman, SMTA International, 2024
Criteria for Solder Alloy Adoption, Deng Yun Chen, Michael Osterman, Carol Handwerker, and Sa’d Hamasha, Journal of Surface Mount Technology, 37(1), 2–7. DOI: doi.org/10.37665/smt.v37i1.41
Swelling in Lithium-Ion Pouch Batteries, Michael Pecht, Michael Osterman, and Sahithi Maddipatla, Pan Pacific Symposium 2024
2023
Investigation into Low-Temperature Solder Reliability, Michael Osterman and Aaron Mendelsohn, SMTA International, 2023
The USPAE Solder Performance and Reliability Assurance Project: Test Plan, Michael Osterman, SMTA International, 2023
2020
Energy Based Modeling for Temperature Cycling Induced Tin Silver Copper Solder Interconnect Fatigue Life, Deng Yun Chen, Michael Osterman, and Abhijit Dasgupta; Microelectronics Reliability, April 2020, DOI: 10.1016/j.microrel.2020.113651.
Development of a Cycle Counting Algorithm with Temporal Parameters, James M. Twomey, Deng Y. Chen, Michael D. Osterman, and Michael G. Pecht; Microelectronics Reliability, April 2020, DOI: 10.1016/j.microrel.2020.113652
2019
Experimental Approach to Determine Damage Curves for SnAgCu Solder Under Sequential Cyclic Loads , Elviz George, Deng Yun Chen, Michael Osterman, and Michael Pecht, Journal of Electronics Materials, Early Access, PP 1-9, 2019, DOI: 10.1007/s11664-019-07811-5.
Life Cycle Trends of Electronic Materials, Processes and Components, Chien-Ming Huang, Jose A. Romero, Michael Osterman, Diganta Das, and Michael Pecht, Microelectronics Reliability, Vol. 99, pp. 262-276, August, 2019 DOI: 10.1016/j.microrel.2019.05.023.