Mechanical Engineering Sophomore Sanjeev Sathyamoorthy wins IEEE EPS award

Sanjeev Sathyamoorthy

Sanjeev Sathyamoorthy, a sophomore in Mechanical Engineering at the University of Maryland, has been selected for the IEEE Electronics Packaging Society (EPS) Undergraduate Hands-on Experience (UHE) Program, receiving a stipend to support his research experience at CALCE.

Under the guidance of Dr. Diganta Das, Sanjeev is conducting research on High-Density Interconnect (HDI) laminates as component substrates, with a focus on implementation, supply chain, and reliability concerns. HDI laminates provide significantly higher wiring density per unit area than conventional printed circuit boards through finer traces and spaces, smaller capture pads, and specialized microvias within a multilayer structure.

Sanjeev’s research focuses on developing a comprehensive overview of HDI boards, including manufacturing, obsolescence, future innovation, and implementation from a reliability perspective. His work examines primary reliability concerns and dominant failure modes in HDI PCB laminates.

His research also evaluates testing methodologies and standard reliability testing protocols for HDI structures. Sanjeev investigates microvia reliability under thermal cycling for stacked and staggered microvia configurations and participates in coupon design testing and thermal-cycle impact simulation. As part of his work, he is investigating the thermal profile in HDI boards in data center applications.

For more information about this opportunity and research, contact Dr. Diganta Das.

Some of CALCE’s previous research on HDI and microvia reliability includes the following publications: