Faculty Directory

1. Warpage Prediction Model of Advanced Substrates

2.  Fiber Bragg Grating (FBG) Sensor System for Advanced Polymer Property Characterization

3. Non-linear Viscoelastic Analysis of EMC for Power Module Application

4. Development of Hybrid Metamodeling Method for Nonlinear DoE analysis with a Large Number of Input Factors

5. Condition Monitoring of Automotive Smart Systems Using Piezoresistive Stress Sensor

6. Physics-of-Failure Based Life Prediction Model for Material Interfaces in Automotive Components

7. Thermal and Thermo-mechanical Characteristics of Cryogenic Microcooler for Optimum Performance and Reliability

8. Risk Propagation during Transition from Development to Manufacturing- Predictive Modeling and Implementation Strategy for Semiconductor Packaging Products

9. Experimental/Numerical Hybrid Approach to Improve Warpage Prediction Accuracy

10. Modeling of Diffusive Moisture Transport

11. Delamination prevention/minimization between interfaces of molding compound, BT/FR4 PCB substrate, IC for System in Package

12. Applicability of IForce sensor for PHM

13. Reliability Assessment of Advanced Microstructures in Chip-scale Packages

Book:

• D. Post, B. Han and P. Ifju, "High Sensitivity Moiré: Experimental Analysis for Mechanics and Materials," Mechanical Engineering Series, Springer-Verlag, NY, 1994. (Student edition, 1997).

Book Chapters:

• D. Post, B. Han and P. Ifju, Chap. 7, “Moiré Methods for Engineering and Science – Moiré Interferometry and Shadow Moiré,” Photomechanics for Engineers, Pramod Rastogi, ed., Springer-Verlag, 2000.
• D. Post, B. Han and P. Ifju, Chap. 24, “Moiré Interferometry,” Trends in Optical Nondestructive Testing and Inspection, R. K. Rastogi, D. Inaudi, ed., Elsevier Science, 2000.
• B. Han et al., Chap. 2, “Strain Measurements at the Limit-the Moiré Microscope,” Handbook of Moiré Measurements, Colin Walker, ed., the Institute of Physics, 2004.
• B. Han et al., Chap. 4, “Electronic Packaging,” Handbook of Moiré Measurements, Colin Walker, ed., the Institute of Physics, 2004.
• B. Han, “14. Characterization of Stresses and Strains in Microelectronic and Photonic Devices Using Photomechanics Methods,” Micro-and Optoelectronic Materials and Structures: Physics, Mechanics, Design, Reliability, and Packaging, Y. C. Lee and A. Suhir, ed., Springer, NY, 2007.
• A. Bar-Cohen, B. Han and K.-J. Kim, “2. Thermo-optic Effects on Polymer Bragg Grating,” Micro-and Optoelectronic Materials and Structures: Physics, Mechanics, Design, Reliability, and Packaging, Y. C. Lee and A. Suhir, ed., Springer, NY, 2007.
• B. Han and D. Post, Chap 21, “Geometric Moiré,” Handbook on Experimental Mechanics, W. N. Sharpe, Jr., ed., Springer-Verlag, NY, 2008.
• D. Post and B. Han, Chap 22, “Moire Interferometry,” Handbook on Experimental Mechanics, W. N. Sharpe, Jr., ed., Springer-Verlag, NY, 2008.
• E. Stellrecht, B. Han and M, Pecht, “Ch. 5 Characterization of Hygroscopic Deformations by Moiré Interferometry,” Moisture Sensitivity of Plastic Packages of IC Devices, X. Fan and E. Suhir eds., Springer, NY, 2010.
• C. Jang and B. Han, Ch. 8 Modeling of Moisture Diffusion and Moisture-induced Stresses in Semiconductor and MEMS Packages, Moisture Sensitivity of Plastic Packages of IC Devices, X. Fan and E. Suhir eds., Springer, NY, 2010.
• B. Han, B.-M. Song and M. Arik, “Chapter 18 Hierarchical Reliability Assessment Models for Novel LED-Based Recessed Down Lighting Systems,” Solid State Lighting Reliability, van Driel, Willem Dirk; Fan, X. J. (Eds.), Springer, NY, 2012.
• D.-S. Kim and B. Han, “Chapter 7 Thermal Characterization of Die-Attach Material Interface of High Power Light Emitting Diodes,” Solid State Lighting Reliability Part 2, Willem Dirk van Driel, Xuejun Fan, and Kouchi Zhang (Eds.), Springer, NY, 2017.
• A. Inamdar, P. Gromala, A. Kabakchiev, Y. Yang and B. Han, “Chapter 3 EMC oxidation under high temperature aging,” Reliability of Organic Compounds in Microelectronics and Optoelectronics, W. van Driel, K. Zhang, X. Fan, and M. Mehr (Eds.), Springer, NY, 2021 (to be published).

Journals:

2021

• K. J. Kim, B. Han, and A. Bar-Cohen, “Thermal and Optical Performance of Cryogenically-Cooled Laser Diode Bars Mounted on Pin Finned Microcoolers,” Applied Physics B, 127, 43 Feb 2021.
• A. Prisacaru, E. M. Oquelis, P. Gromala, B. Han, G. Q. Zhang, “Degradation Estimation and Prediction of Electronic Packages using Data Driven Approach,” IEEE Transactions on Industrial Electronics, doi: 10.1109/TIE.2021.3068681, March 2021.
• A. Inamdar, Y.-H. Yang, A. Prisacaru, P. Gromala, and B. Han, “High Temperature Aging of Epoxy-based Molding Compound and Its Effect on Mechanical Behavior of Molded Electronic Package,” Polymer Degradation and Stability, Volume 188, 109572, April  2021.
• A Prisacaru, E. O. Guerrero, B. Chimmineni, P. Gromala, Y.-H. Yang, B. Han, and G. Zhang, “Towards Virtual Twin for Electronic Packages in Automotive Applications,” Microelectronics Reliability, Vol. 122, 114134, July 2021. 
• Y.-H. Yang, H.-P. Wei, B. Han, and C. Hu, “Bivariate Cut-HDMR Metamodel for Semiconductor Packaging Design Problems with a Large Number of Input Variables,” Materials, materials-1327924: DOI 10.3390/ma14164619, August 2021. 
• C. Kim, S. Prashant Phansalkar, H.-S. Lee and B. Han, “Measurement of Effective Cure Shrinkage of Epoxy Molding Compound by FBG Sensor Using Two-Stage Curing,” Journal of Applied Polymer Science, e51620. https://doi.org/10.1002/app.51620, 2021.

2020

• H.-P. Wei, Y.-H. Yang, and B. Han, “Stacking Yield Prediction of Package-on-Package Assembly Using Advanced Uncertainty Propagation Analysis: Part I Stochastic Model Development,” Journal of Electronic Packaging, 142(1): 011001, March 2020.
• H.-P. Wei, Y.-H. Yang, and B. Han, “Stacking Yield Prediction of Package-on-Package Assembly Using Advanced Uncertainty Propagation Analysis: Part II Implementation of Stochastic Model,” Journal of Electronic Packaging, 142(1): 011002, March 2020.
• A. Roman, B. Wu, B. Han, G. M. Reinacher, and S. G. Yousef, “Moisture Transport through Fiber-Reinforced Composite Materials Enclosing Critical Automotive Electronics Composites,” IEEE Transactions on Components, Packaging and Manufacturing Technology, vol. 10, no. 9, pp. 541-550, April 2020.
• S. Phansalkar, C. Kim, B. Han, P. Gromala, “Volumetric Effective Cure Shrinkage Measurement of Dual Curable Adhesives by Fiber Bragg Grating Sensor," Journal of Materials Science, 55(22), 9655-9664, May 2020.
• Y.-H. Yang, B. Han, A. Prisacaru, P. Gromala, S. Jiang, and A. Sarwar, “In-Situ Service Load Monitoring of Automotive Electronic Systems Using Silicon-Based Piezoresistive Stress Sensor,” Microelectronics Reliability, Vol. 110, pp. 113650, July 2020.

2019

• B. Wu, D. Kim, B. Han, A. Palczynska, A. Prisacaru and P. J. Gromala, "Hybrid Approach to Conduct Failure Prognostics of Automotive Electronic Control Unit Using Stress Sensor as In-Situ Load Counter," IEEE Transactions on Components, Packaging and Manufacturing Technology, vol. 9, no. 1, pp. 28-38 (2019).
• J. Lee, H. Oh, C. H. Park, B. D. Youn, and B. Han, “Test Scheme and Degradation Model of Accumulated ESD Damage for IGBT Prognostics,” IEEE Transactions on Device and Materials Reliability, vol. 19, no. 1, pp. 233-241, March 2019.
• H.-P. Wei, Y.-H. Yang, and B. Han, “Advanced Statistical Model Calibration to Determine Manufacturing-induced Variations of Effective Elastic Properties of SAC Solder Joints in Leadless Chip Resistor Assemblies,” IEEE Transactions on Components, Packaging and Manufacturing Technology, vol. 9, no. 4, pp. 797-804, April 2019.
• B. Wu, Y.-H. Yang, B. Han and J. Schumacher, “Measurements of Inelastic Strain Evolution of Single Solder Grain Subject to Nominal Shear Loading,” Experimental Mechanics, vol. 59, no. 7, pp. 1075-1086, 2019.
• A. Prisacaru, A. Palczynska, P. Gromala, B. Wu, B. Han, and G. Q. Zhang, “On the Accuracy of CMOS-based Piezoresistive Stress Sensor: Theoretical Review and Experimental Validation,” IEEE Sensors Journal, vol. 19, no. 20, pp. 9139-9148, Oct. 2019.
• W. Diao, S. Saxena, B. Han, and M. Pecht, “Algorithm to Determine the Knee Point on Capacity Fade Curves of Lithium ion Cells,” Energies, 12(15), 2019.  

2018

• A. Palczynska, A. Prisacaru, P. J. Gromala, B. Han, D. Mayer, and T. Melz, "Towards prognostics and health monitoring: The potential of fault detection by piezoresistive silicon stress sensor," Microelectronics Reliability, Vol. 74, pp. 165-172 (2017).
• B. Wu and B. Han, "Advanced Mechanical/Optical Configuration of Real-Time Moiré Interferometry for Thermal Deformation Analysis of Fan-Out Wafer Level Package," IEEE Transactions on Components, Packaging and Manufacturing Technology, vol. 8, no. 5, pp. 764-772 (2018).
• A. Prisacaru, A. Palczynska, A. Theissler, P. Gromala, B. Han, and G. Q. Zhang, “In Situ Failure Detection of Electronic Control Units Using Piezoresistive Stress Sensor,” IEEE Transactions on Components, Packaging and Manufacturing Technology, Vol. 8, No. 5, (2018).
• B. Wu, Y.-H. Yang, B. Han and J. Schumacher, “Measurement of Anisotropic Coefficients of Thermal Expansion of SAC305 Solder Using Surface Strains of Single Grain with Arbitrary Orientation,” Acta Materialia, Vol. 156, pp. 196-204 (2018).
• H. S. Lee, Y. Sun, C. Kim and B. Han, "Characterization of Linear Viscoelastic Behavior of Epoxy Molding Compound Subjected to Uniaxial Compression and Hydrostatic Pressure," IEEE Transactions on Components, Packaging and Manufacturing Technology, Vol. 8, no. 8, pp. 1363-1372 (2018).

2017

• Y. Sun, H.-S. Lee, and B. Han, “Measurement of Elastic Properties of Epoxy Molding Compound by Single Cylindrical Configuration with Embedded Fiber Bragg Grating Sensor,” Experimental Mechanics, Vol. 57, pp. 313–324, (2017). 
• B. Han and D.-S. Kim, “Moisture Ingress, Behavior and Prediction inside Semiconductor Packaging: A Review,” Journal of Electronic Packaging, Vol. 139, pp 010802-1: DOI: 10.1115/1.4035598 (2017).
• P. Zhang, D.-S. Kim, and B. Han, “Deconvolution of Spectral Power Distribution of High-Power Laser Diode Arrays,” Applied Optics, Vol. 56, No. 20, pp. 5590-5598 (2017).
• H.-P. Wei, B. Han, B. D. Youn, H. Shin, I. Kim and H. Moon, “Assembly Yield Prediction of Plastically Encapsulated Packages with a Large Number of Manufacturing Variables by Advanced Approximate Integration Method,” Microelectronics Reliability, Vol. 78, pp. 319-330 (2017).
• A. Palczynska, A. Prisacaru, P. J. Gromala, B. Han, D. Mayer, and T. Melz, "Towards prognostics and health monitoring: The potential of fault detection by piezoresistive silicon stress sensor," Microelectronics Reliability, Vol. 74, pp. 165-172 (2017).

2016

• H. Oh, H.-P. Wei, B. Han and B. D. Youn, “Probabilistic Lifetime Prediction of Electronic Packages Using Advanced Uncertainty Propagation Analysis and Model Calibration,” IEEE Transactions on Components, Packaging and Manufacturing Technology; Vol. 6, No. 2, pp. 238 – 248, DOI: 10.1109/TCPMT.2015.2510398 (2016).
• D.-S. Kim and B. Han, “Effect of Junction Temperature on Heat Dissipation of High Power Light Emitting Diodes,” Journal of Applied Physics, 119, 125104, DOI:10.1063/1.4944800 (2016).
• K. Mahan, B. Kim, B. Wu, B. Han, I. Kim, H. Moon, and Y. N. Hwang, “Modified single cantilever adhesion test for EMC/PSR interface in thin semiconductor packages,” Microelectronics Reliability, 63, pp. 134-141, DOI: 10.1016/j.microrel.2016.05.015 (2016).
• K. Mahan, D. Rosen, and B. Han, “Blister Testing for Adhesion Strength Measurement of Polymer Films Subjected to Environmental Conditions,” Journal of Electronic Packaging, 138 (4), 041003, DOI:10.1115/1.4034454 (2016).
• D.-S. Kim, C. Holloway, B. Han, and A. Bar-Cohen, “Method for Predicting Junction Temperature Distribution in High Power Laser Diode Bar,” Applied Optics, Vol. 55, No. 27, pp. 7487-7496, (2016).
• A. Palczynska, P. J. Gromala, D. Mayer, B. Han, and T. Melz, “In-Situ Investigation of EMC Relaxation Behavior Using Piezoresistive Stress Sensor,” Microelectronics Reliability, Vol. 62, pp. 58–62 (2016).  

2015

• D.-S. Kim, B. Han and A. Bar-Cohen, “Characterization of Die-Attach Thermal Interface of High Power Light Emitting Diodes: An Inverse Approach,” IEEE Transactions on Components, Packaging and Manufacturing Technology, Vol. 5, No. 11, pp. 1635 – 1643, DOI: 10.1109/ TCPMT.2015.2472400 (2015).
• J. M. Ha, B. D. Youn, H. Oh, B. Han and Y. Jung, “Autocorrelation-based time synchronous averaging for condition monitoring of planetary gearboxes wind turbines,” Mechanical Systems and Signal Processing, Vol. 70-71, pp. 161–175, DOI: 10.1016/j.ymssp.2015.09.040 (2015).
• H. Oh, B. Han, P. McCluskey, C. Han and B. D. Youn, “Physics-of-Failure, Condition Monitoring and Prognostics of Insulated Gate Bipolar Transistor Modules: A Review,” IEEE Transactions on Power Electronics, Vol. 30, No. 5, pp. 2413-2416 (2015).

2014

• D. Kim, B. Han and Y.-J. Kim, “Degradation Analysis of Secondary Lens System and its Effect on Performance of LED-based Luminaire,” Microelectronics Reliability, Vol. 54, No. 1, PP. 131–137; doi 10.1016/j.microrel.2013.08.007 (2014).
• Y. Sun, Y. Wang, Y. Kim and B. Han, “Dual-Configuration Fiber Bragg Grating Sensor Technique to Measure Coefficients of Thermal Expansion and Hygroscopic Swelling,” Experimental Mechanics, Vol. 54, No. 4, pp. 593-603; doi 10.1007/s11340-013-9804-8 (2014).
• C. Han and B. Han, “Board Level Reliability Analysis of Chip Resistor Assemblies under Thermal Cycling: A Comparison Study between SnPb and SnAgCu,” Journal of Mechanical Science and Technology, Vol. 28, No. 3, pp. 879-996; doi 10.1007/s12206-013-1154-z (2014).
• B. Jang and B. Han, “Hygrothermal Behavior of Advanced Polymers above Water Boiling Temperatures,” Journal of Electronic Packaging, Vol. 136, No. 1, 011013; doi 10.1115/1.4026626 (2014).
• K. Mahan, Y. Sun, B. Han, S. Han and M. Osterman, “Adhesion and Puncture Strength of Polyurethane Coating Used to Mitigate Tin Whisker Growth,” Journal of Electronic Packaging, Vol. 136, No. 3, 031004; doi 10.1115/1.4026922 (2014).
• Y. Sun, B. Han, E. Parsa and A. Dasgupta, “Measurement of Effective Chemical Shrinkage and Equilibrium Modulus of Silicone Elastomer Used in Potted Electronic System,” Journal of Materials Science, Vol. 49, No. 24, pp. 8301-8310; doi 10.1007/s10853-014-8538-z (2014).

2013

• B. Song and B. Han, “SPD Deconvolution Scheme for Phosphor Converted White LED Using Multiple Gaussian Functions,” Applied Optics, Vol. 52, No. 5, pp. 1016–1024 (2013).
• Y. Sun, Y. Wang, C. Jang, B. Han and K. Y. Choi, “Generalized Hybrid Modeling to Determine Chemical Shrinkage and Modulus Evolution at Arbitrary Temperatures,” Experimental Mechanics, DOI: 10.1007/s11340-013-9752-3 (2013). 
• B. Song and B. Han, “Analytical/Experimental Hybrid Approach Based on Spectral Power Distribution for Quantitative Degradation Analysis of Phosphor Converted LED,” Transactions on Device and Materials Reliability, DOI: 10.1109/TDMR.2013.2269478 (2013).
• B. Song, B. Han and J.-H. Lee, “Optimum design domain of LED-based solid state lighting considering cost, energy consumption and reliability,” Microelectronics Reliability, Vol. 53, No. 3, Pages 435–442 (2013).

2012

• B. Song, B. Han, A. Bar-Cohen, M. Arik, R. Sharma and S. Weaver, “Life Prediction of LED-Based Recess Downlight Cooled by Synthetic Jet,” Microelectronics Reliability, Vol. 52, No. 5, pp. 937–948 (2012).
• K. Joon Kim, A. Bar-Cohen, and B. Han, “Thermal–structural modeling of polymer Bragg grating waveguides illuminated by a light emitting diode,” Applied Optics, Vol. 51, No. 6, pp. 726-734 (2012).
• B. Han, “Measurements of True Leak Rates of MEMS Packages,” Sensors, Vol. 12, No. 3, pp. 3082-3104, (2012).
• H.-S. Seo, B. Han and Y.-J. Kim, Numerical Study on the Mixing Performance of a Ring-Type Electroosmotic Micromixer with Different Obstacle Configurations,” J. of Nanoscience & Nanotechnology, Vol. 12, pp. 4523-4530 (2012).

2011

• Y. Wang, L. Woodworth and B. Han, “Simultaneous Measurement of Effective Chemical Shrinkage and Modulus Evolutions during Polymerization,” Experimental Mechanics, Vol. 51, No. 7, pp. 1155–1169 (2011).

2010

• C. Jang, B. Youn, P. F. Wang, B. Han and S.-J. Ham, “Forward-stepwise Regression Analysis for Fine Leak Batch Testing of Multiple MEMS Package,” Microelectronics Reliability, Vol. 18, No. 3, pp. 577-587 (2010).
• C. Jang and B. Han, “Analytical and Molecular Simulation Study of Water Condensation Behavior in Mesopores with Closed Ends, The Journal of Chemical Physics, Vol. 132, 104702 (2010).
• I. Sher, B. Han and A. Bar-Cohen, “Modified Coupled-Mode Model for Thermally Chirped Polymer Bragg Gratings,” Applied Optics, Vol. 49, No. 11, pp. 2079 - 2084 (2010).  
• C. Jang, S. Yoon and B. Han, “Measurement of the Hygroscopic Swelling Coefficient of Thin Film Polymers Used in Semiconductor Packaging,” IEEE Transactions on Components and Packaging Technologies, Vol. 33, No. 2, pp. 340-346 (2010).
• H. Bi, C. Jang and B. Han, “Nano-Pattern Recognition and Correlation Technique for Sub-Nanometer In-Plane Displacement Measurement,” Experimental Mechanics, Vol. 50, No. 8, pp. 1169-1181 (2010).  
• P. Ifju and B. Han, “Recent Applications of Moiré Interferometry,” Experimental Mechanics, Experimental Mechanics, Vol. 50, No. 8, pp. 1129-1147 (2010).
• M. Arik, J. Jackson, S. Prabhakaran, C. Seeley, R. Sharma, Y. Utturkar, S. Weaver, G. Kuenzler and B. Han, “Development of a High Lumen Solid State Down Light Application,” IEEE Transactions on Components and Packaging Technologies, Vol. 33. No. 4, pp. 668-679 (2010).
• B. Han, C. Jang, A. Bar-Cohen and B. Song, “Coupled Thermal and Thermo-mechanical Design Assessment of High Power Light Emitting Diode,” IEEE Transactions on Components and Packaging Technologies, Vol. 33. No. 4, pp. 688-697 (2010).
• D. W. Kim, E. Rahim, A. Bar-Cohen and B. Han, “Direct Submount Cooling of High Power LED’s,” IEEE Transactions on Components and Packaging Technologies, Vol. 33. No. 4, pp. 698-712 (2010).
• B. Song, B. Han, A. Bar-Cohen, R. Sharma and M. Arik, “Hierarchical Life Prediction Model for Actively Cooled LED-Based Luminaire,” IEEE Transactions on Components and Packaging Technologies, Vol. 33. No. 4, pp. 728-737 (2010).
• C. Jang, B. Han and S. Yoon, “Comprehensive Moisture Diffusion Characteristics of Epoxy Molding Compounds over Solder Reflow Process Temperature,” IEEE Transactions on Components and Packaging Technologies, Vol. 33. No. 4, pp. 809-818 (2010).

2009

• C. Jang and B. Han, “Analytical Solutions of Gas Transport Problems in Inorganic/Organic Hybrid Barrier Structures,” Journal of Applied Physics, 105, 093532 (2009).
• A. Goswami, B. Han, S.-J. Ham and B.-G. Jeong, “Quantitative Characterization of True Leak Rate of Micro to Nanoliter Packages Using a Helium Mass Spectrometer”, IEEE Transactions on Advanced Packaging, Vol. 32, No. 2, pp. 440-447 (2009).
• C. Jang, A. Goswami and B. Han, “Hermeticity Evaluation of Polymer-Sealed MEMS Packages by Gas Diffusion Analysis,” IEEE/ASME Journal of Microelectromechanical Systems, Vol. 18, No. 3, pp. 577-587 (2009).
• C. Jang, A. Goswami, B. Han and S. Ham, “In-situ Measurement of Gas Diffusion Properties of Polymeric Seals Used in MEMS Packages by Optical Gas Leak Test,” Journal of Micro/Nanolithography, MEMS, and MOEMS, Vol. 8, No. 4, 043025 (2009).

2008

• Y. Wang, B. Han, D. W. Kim, A. Bar-Cohen and P. Joseph, “Integrated Measurement Technique for Curing Process-dependent Mechanical Properties of Polymeric Materials Using Fiber Bragg Grating,” Experimental Mechanics, Vol. 48, pp. 107-117 (2008).
• A. Goswami and B. Han, “On Ultra-Fine Leak Detection of Hermetic Wafer Level Packages,” IEEE Transactions on Advanced Packaging, Vol. 31, No. 1, pp. 14-21 (2008).
• C. Jang, S. Park, B. Han and S. Yoon, “Advanced Thermal-Moisture Analogy Scheme for Anisothermal Moisture Diffusion Problem, Journal of Electronic Packaging, Vol. 130, pp. 011004 (2008).
• S. Yoon, C. Jang and B. Han, “Nonlinear Stress Modeling Scheme to Analyze Semiconductor Packages Subjected to Combined Thermal and Hygroscopic Loading,” Journal of Electronic Packaging, Vol. 130, 024502-1/6 (2008).
• C. Jang, Y. Cho and B. Han, “Ideal Laminate Theory for Water Transport Analysis of Inorganic/Organic Multilayer Barrier Films,” Applied Physics Letters, Vol. 93, 13307 (2008).
• A. Goswami and B. Han, “On Applicability of MIL-Spec-Based Helium Fine Leak Test to Packages with Sub-micro liter Cavity Volumes”, Microelectronics Reliability, Vol. 48, pp. 1815–1821 (2008).